PCB and FPC circuit board UV picosecond laser cutting process

Nowadays, there are more and more electronic products and more and more extensive applications. As the core component of electronic products, circuit boards play an important role. Common circuit boards on the market mainly include FPC circuit boards and PCB circuit boards. FPC circuit board generally refers to flexible circuit board, which is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness, and good flexibility. PCB is a kind of printed circuit board, which is a rigid board, which cannot be bent or flexed. For FPC flexible circuit boards and PCBs For the cutting of printed circuit boards, the editor today will mainly introduce a piece of equipment—ultraviolet picosecond laser cutting machine

Called PCB circuit board cutting machine, it uses ultraviolet cold light source as laser, with small heat affected area, high precision and long life. Using non-contact laser processing technology, there will be no mechanical stress and deformation on the circuit board. You can set up complex and special-shaped patterns according to your needs, import the equipment, and easily realize the cutting and splitting of the circuit board. The precise and fine light source of the UV picosecond laser cutting machine can improve the cutting accuracy of PCB circuit boards and FPC circuit boards. The cutting edges are smooth and free of burrs. It is formed at one time and does not require subsequent processes.

Recommended model: UV picosecond laser cutting machine

1. Using ultra-short pulse ultraviolet picosecond laser, can achieve 'cold' processing technology

2. Using marble platform X/Y system, using linear motor drive system to ensure platform Accuracy and stability of high-speed operation

3. Equipped with high-pixel CCD automatic alignment function to ensure accurate product cutting and alignment

4. Ultra-large format telecentric field lens can be configured , To ensure that large-format products are not spliced u200bu200bwhen processing large-format products, and the processing format can reach 200*200mm

5. Equipped with high-precision galvanometers to ensure product processing accuracy and corner technology effects, and the repeatability can reach 1 micron

Widely used in the cutting of organic materials and inorganic materials, especially suitable for PCB cutting and splitting, FPC cutting, cover film cutting and opening, silicon wafer cutting/scribing, Ceramic cutting/scribing/drilling, glass cutting/scribing/texturing, fingerprint recognition chip cutting, PET film cutting, PI film cutting, copper foil and other ultra-thin metal cutting, drilling, composite material cutting, etc.